01

Where does the design stop meeting the product requirement?

A chip, a sensor module and the electronics around an instrument create different engineering demands. Start with the design, integration or validation bottleneck in the actual product.

02

Capabilities to explore

  • Chip design and AI-assisted engineering tools
  • Advanced electronics and sensor-module integration
  • Packaging, test and reliability engineering
  • Hardware–software co-design and prototype development
03

Explore the geography

Public capability concentrations

04

What should we examine next?

Is the constraint in design tools, the chip, packaging, board integration or test? Bring the performance target and the result that falls short.