01
Where does the design stop meeting the product requirement?
A chip, a sensor module and the electronics around an instrument create different engineering demands. Start with the design, integration or validation bottleneck in the actual product.
02
Capabilities to explore
- Chip design and AI-assisted engineering tools
- Advanced electronics and sensor-module integration
- Packaging, test and reliability engineering
- Hardware–software co-design and prototype development
03
Explore the geography
Public capability concentrations
04
Instrument and micro/nano work in Huairou
Huairou Science City’s Industrial Transformation Demonstration Zone brings together instrument, sensor and semiconductor projects. Its micro/nano platform record distinguishes reported equipment from later expansion works. Send the process, sample dimensions and batch size to Leo to explore the relevant service.
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05
What is blocking the next version?
Is the constraint in design tools, the chip, packaging, board integration or test? Bring the performance target and the result that falls short.